A new fabrication method of low stress PECVD SiNx layers for biomedical applications

A new fabrication method of low stress PECVD SiNx layers for biomedical applications

Author(s): Wei J, Ong PL, Tay FEH, Iliescu C. Thin Solid Films. 2008;516(16):5181–5188.

A new fabrication method to produce low residual stress PECVD SiNx layers at high deposition rates was developed and their biomedical applications… Read More »

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